Professional CPU Heat Sink Manufacturing Services
Advanced Processor Cooling Solutions for Gaming, Workstations & Servers
Leading CPU Heat Sink Manufacturer
With decades of expertise in thermal management solutions, we deliver precision-engineered CPU heat sinks that maximize processor performance while ensuring reliable operation across all computing applications.
Advanced Technology
Heat pipe integration, tower designs, and precision manufacturing
Custom Solutions
Tailored heat sinks for specific CPU sockets and applications
Quality Assured
ISO certified manufacturing with rigorous testing standards
Fast Delivery
Rapid prototyping and efficient production timelines
Our CPU Heat Sink Solutions
Comprehensive range of processor cooling solutions for every application
Tower CPU Coolers
High-performance tower design with aluminum fins and copper heat pipes for maximum cooling efficiency.
- 4-8 Heat Pipe Configuration
- Aluminum Tower Fins
- Copper Base Plate
- Gaming & Workstation Ready
Passive CPU Coolers
Silent operation with large heatsink designs for fanless cooling solutions.
- 0dB Silent Operation
- Large Surface Area
- Premium Materials
- High-End Applications
Low Profile Heat Sinks
Compact designs for space-constrained applications and server environments.
- Compact Form Factor
- Server Optimized
- Efficient Design
- Space Saving
Dual Tower Coolers
Ultimate cooling performance with dual tower design and multiple fans.
- Dual Tower Design
- Multiple Fan Support
- Maximum Performance
- Overclocking Ready
Server Heat Sinks
Enterprise-grade cooling solutions for data center and server applications.
- Enterprise Grade
- 24/7 Operation
- High Reliability
- Multi-Socket Support
Custom Solutions
Bespoke heat sink designs tailored to specific requirements and applications.
- Custom Design
- Precision Manufacturing
- Application Specific
- Engineering Support
Advanced Manufacturing Processes
State-of-the-art production techniques for superior heat sink quality
Manufacturing Excellence
Precision Extrusion
High-temperature aluminum extrusion process creating complex fin geometries with tight tolerances.
Advanced Skiving
Precision skiving technology for ultra-thin fins and maximum surface area enhancement.
Cold Forging
High-pressure forming process for superior thermal conductivity and structural integrity.
CNC Machining
Computer-controlled precision machining for complex custom heat sink designs.
Heat Pipe Technology Integration
Advanced thermal management with copper heat pipe technology
Superior Heat Transfer
Our heat pipe integration technology delivers thermal conductivity over 1000 times greater than solid copper, enabling rapid heat transfer from CPU to cooling fins.
1000x Faster
Heat transfer compared to solid copper tubes
Instant Response
Rapid thermal response to CPU load changes
Compact Design
Efficient heat distribution in limited space
Reliable Operation
Long-term durability and performance
Premium Materials & Technology
High-performance materials optimized for thermal efficiency
Pure Copper Base
388 W/mK thermal conductivity for maximum heat absorption from CPU surface.
Aluminum Fins
167 W/mK thermal conductivity with lightweight design for optimal heat dissipation.
Advanced Alloys
6061/6063 aluminum alloys and specialized copper alloys for enhanced performance.
Performance Comparison
Applications & Industries
Cooling solutions for every computing environment
Gaming PCs
High-performance cooling for gaming processors, enabling sustained boost clocks and overclocking capabilities.
- • Overclocking support
- • Sustained performance
- • RGB compatibility
- • Quiet operation
Workstations
Professional-grade cooling for content creation, CAD work, and computational tasks requiring sustained performance.
- • Professional reliability
- • Long-term stability
- • Silent operation
- • Precision cooling
Data Centers
Enterprise-grade server cooling solutions for 24/7 operation in demanding data center environments.
- • 24/7 operation
- • Enterprise grade
- • High density cooling
- • Energy efficient
Compact Systems
Low-profile cooling solutions for mini-ITX builds, HTPCs, and space-constrained applications.
- • Compact design
- • Space efficient
- • Low profile
- • Optimized airflow
Overclocking
Extreme cooling solutions for enthusiasts and competitive overclocking with maximum thermal headroom.
- • Extreme cooling
- • Overclocking ready
- • Thermal headroom
- • Performance tuning
Industrial
Ruggedized cooling solutions for industrial computers, embedded systems, and harsh environment applications.
- • Industrial grade
- • Harsh environments
- • Reliable operation
- • Extended temperature
Technical Specifications
Comprehensive performance data and compatibility information
Performance Metrics
Socket Compatibility
Intel Sockets
- • LGA 1700
- • LGA 1200
- • LGA 1151
- • LGA 1150
- • LGA 1155
- • LGA 1156
- • LGA 2011
- • LGA 2066
- • LGA 4677
AMD Sockets
- • AM5
- • AM4
- • AM3+
- • AM3
- • FM2+
- • FM2
- • TR4
- • sTRX4
- • SP3
Why Choose Our CPU Heat Sinks?
Premium Quality
Precision manufacturing with premium materials
Superior Performance
Maximized cooling efficiency and reliability
Expert Support
Technical expertise and customer service
Fast Delivery
Rapid prototyping and production timelines
Frequently Asked Questions
Expert answers to common CPU heat sink questions
What factors determine CPU heat sink performance?
CPU heat sink performance depends on several key factors: thermal conductivity of materials (copper base plates offer 388 W/mK vs aluminum's 167 W/mK), surface area of fins, heat pipe integration, airflow design, and mounting pressure. The combination of copper base plates with aluminum fins provides optimal heat absorption and dissipation.
How do tower heat sinks compare to low-profile designs?
Tower heat sinks offer superior cooling performance due to larger surface area and vertical fin orientation that optimizes natural convection. They typically handle 150-300W TDP vs 65-95W for low-profile designs. However, low-profile heat sinks are essential for space-constrained builds, server applications, and compact systems where height clearance is limited.
What's the advantage of heat pipe technology in CPU coolers?
Heat pipes provide thermal conductivity over 1000 times greater than solid copper tubes of the same size. They enable rapid heat transfer from the CPU to the fin array through phase-change cooling, offering instant thermal response and efficient heat distribution across the entire heatsink surface.
When should I choose passive vs active CPU cooling?
Passive cooling (fanless) is ideal for silent operation, low-power CPUs (under 65W TDP), and environments where noise is critical. Active cooling with fans is necessary for high-performance processors, gaming systems, and applications requiring sustained performance under load. Passive solutions require larger heatsinks and excellent case airflow.
How important is proper mounting pressure for CPU heat sinks?
Proper mounting pressure is crucial for optimal thermal interface between CPU and heatsink. Insufficient pressure creates air gaps that dramatically increase thermal resistance, while excessive pressure can damage the CPU or socket. Our mounting systems are engineered to provide optimal pressure distribution across the CPU surface.
What manufacturing processes provide the best heat sink performance?
Skiving offers the highest performance with ultra-thin fins (0.2mm) and maximum surface area, providing 22% better thermal conductivity than extrusion. Cold forging creates superior thermal conductivity with 15% better performance than extrusion. CNC machining allows complex custom geometries but is typically reserved for specialized applications.
How do I select the right CPU heat sink for gaming applications?
For gaming, choose heat sinks rated 20-30% above your CPU's TDP to maintain boost clocks. Tower designs with 4-6 heat pipes, copper base plates, and 120-140mm fans provide excellent performance. Consider noise levels (under 25 dBA), RGB compatibility, and RAM clearance for your specific build requirements.
What maintenance do CPU heat sinks require?
Clean fans and fins every 6-12 months using compressed air to remove dust buildup. Replace thermal paste every 2-3 years or when temperatures increase. Check mounting pressure annually and inspect for corrosion or damage. Proper maintenance ensures sustained cooling performance and component longevity.
Can CPU heat sinks be used for overclocking applications?
Yes, high-performance heat sinks are essential for overclocking. Choose models rated for 150-200% of base TDP, dual-tower designs with multiple heat pipes, and high-static pressure fans. Our overclocking-grade heat sinks provide the thermal headroom necessary for sustained high frequencies and voltage increases.
What quality standards do your CPU heat sinks meet?
Our heat sinks are manufactured to ISO 9001 quality standards with rigorous testing protocols. We conduct thermal resistance testing, vibration testing, life cycle testing (50,000+ hours), and compatibility verification across all major CPU sockets. All products undergo final inspection before shipment.
Do you offer custom CPU heat sink design services?
Yes, we provide comprehensive custom design services including thermal analysis, CFD modeling, prototype development, and production manufacturing. Our engineering team works with clients to develop application-specific solutions for unique thermal challenges, space constraints, or performance requirements.
What lead times should I expect for custom orders?
Standard products ship within 5-7 business days. Custom designs require 2-3 weeks for initial prototyping, followed by 4-6 weeks for production tooling and manufacturing. Rush orders available with expedited timelines. Contact our engineering team to discuss specific project requirements and timelines.
How do server heat sinks differ from desktop models?
Server heat sinks are designed for 24/7 operation, higher TDP processors (up to 300W+), and optimized airflow in rack environments. They feature robust mounting systems, enterprise-grade materials, extended temperature ratings, and compliance with data center acoustic requirements. Many include active cooling with high-static pressure fans.
What thermal interface materials work best with your heat sinks?
We recommend high-quality thermal pastes with conductivity of 5-8 W/mK for optimal performance. Thermal pads are suitable for easy installation but offer slightly lower performance. Liquid metal interfaces provide maximum conductivity (>70 W/mK) but require careful application. All our heat sinks include premium thermal paste.
What warranty and support do you provide?
All CPU heat sinks include a 5-year warranty covering manufacturing defects and performance degradation. We provide comprehensive technical support including installation guidance, thermal optimization recommendations, and troubleshooting assistance. Extended warranties and service contracts available for enterprise customers.